With lab. Semiconductor instructional processing laboratory (SIPL) and lectures. Principles and practice of modern microelectronic silicon device processing. Theory and practice of basic processing technology including photo-lithography, oxidation, diffusion, thin film deposition, ion implantation, packaging, yield, and process integration. State-of-the-art laboratory fabrication of working microelectronic devices and process simulation techniques. Prerequisite: E&C-ENG 344.

With lab. Semiconductor instructional processing laboratory (SIPL) and lectures. Principles and practice of modern microelectronic silicon device processing. Theory and practice of basic processing technology including photo-lithography, oxidation, diffusion, thin film deposition, ion implantation, packaging, yield, and process integration. State-of-the-art laboratory fabrication of working microelectronic devices and process simulation techniques. Prerequisite: E&C-ENG 344.

With lab. Semiconductor instructional processing laboratory (SIPL) and lectures. Principles and practice of modern microelectronic silicon device processing. Theory and practice of basic processing technology including photo-lithography, oxidation, diffusion, thin film deposition, ion implantation, packaging, yield, and process integration. State-of-the-art laboratory fabrication of working microelectronic devices and process simulation techniques. Prerequisite: E&C-ENG 344.

With lab. Semiconductor instructional processing laboratory (SIPL) and lectures. Principles and practice of modern microelectronic silicon device processing. Theory and practice of basic processing technology including photo-lithography, oxidation, diffusion, thin film deposition, ion implantation, packaging, yield, and process integration. State-of-the-art laboratory fabrication of working microelectronic devices and process simulation techniques. Prerequisite: E&C-ENG 344.

This class covers the fundamental of the nanoelectronics discipline ranging from nanophysics, to nano structures and nanodevices. It provides first an overview of the fundamental physical principles required for understanding the electronic properties of matter at the nanoscale. From the basic description of quantum dots, wires and wells, we will review the main electrical property differences between atoms, molecules and nanostructures including Carbon nanotubes and Nanoribbons. An introduction to the electron transport properties in nanostructures is also provides.

Introduction to digital communications at the graduate level. Signaling formats, optimal receivers, and error probability calculations. Introduction to error control coding, source coding, and information theory. Prerequisite: undergraduate probability.

With lab. Semiconductor instructional processing laboratory (SIPL) and lectures. Principles and practice of modern microelectronic silicon device processing. Theory and practice of basic processing technology including photo-lithography, oxidation, diffusion, thin film deposition, ion implantation, packaging, yield, and process integration. State-of-the-art laboratory fabrication of working microelectronic devices and process simulation techniques. Prerequisite: E&C-ENG 344.

The nature of electromagnetic fields and waves. Transmission lines modeled as distributed circuits. Propagation of waves and wave reflections on transmission lines. Review of vector analysis, coordinate systems, gradient, divergence, curl; review of surface and volume integrals. Electrostatic and magnetostatic fields and boundary conditions. Fields in conductors, dielectrics and magnetic materials. Time-varying fields and electromagnetic induction. Maxwell's equations for time-varying fields.